Description
Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals Low-power auto self refresh (LPASR) Data bus inversion (DBI) for data bus On-die VREFDQ generation and calibration On-board I2C serial presence-detect (SPD) EEPROM Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) Selectable BC4 or BL8 on-the-fly (OTF) Databus write cyclic redundancy check (CRC) Temperature controlled refresh (TCR) Command/Address (CA) parity Per DRAM Addressability is supported 8 bit pre-fetch Fly-by topology Command/Address latency (CAL) Terminated control command and address bus PCB: Height 1.23″ (31.25mm) Gold edge contacts RoHS Compliant and Halogen-Fre Netac Basic DDR4Original chips improve the performance of computerSelected original chips, strict inspection process, 8-layer PCB board, stable performanceExcellent compatibilityMemory products have passed the motherboard compatibility test of mainstream brands on the market, ensure the stability of the system for along timeGold-plated craft gold fingerGold plating process, stronger conductivity and corrosion resistance Features Lead plating Gold SPD profile Yes Programming power voltage (VPP) 2.5 V Intel Extreme Memory Profile (XMP) Yes Memory voltage 1.35 V Memory channels Single-channel CAS latency 16 ECC No Memory form factor 288-pin DIMM Component for PC/Server Memory clock speed 3200 MHz Internal memory type DDR4 Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Buffered memory type Unregistered (unbuffered) Operational conditions Storage temperature (T-T) -55 – 100 °C Operating temperature (T-T) 0 – 85 °C General Product family Basic Technical details Compliance certificates RoHS Sustainability Doesn’t contain Halogen Weight & dimensions Height 31.2 mm Width 133.3 mm leaflet